現(xiàn)整理FPC軟板可靠性測試項目中英文對照如下：

電氣性能 Testing of Electrical Performance

導(dǎo)線電阻 Conductor Resistance

表面層絕緣電阻 Surface Insulation Resistance (SIR)

表面介質(zhì)層耐電壓強(qiáng)度 Dielectric Withstanding Voltage of Surface Layers

機(jī)械性能測試 Testing of Mechanical Property

剝離強(qiáng)度 Peel Strength

孔和焊墊的拉脫強(qiáng)度 Pull-out Strength for Plain Holes and Footprints

鍍層附著力 Plating Adhesion

可焊性 Solderability

耐撓曲性 Flexural Endurance

耐彎折性 Bending Resistance

環(huán)境性能 Environmental Performance

溫度循環(huán) Temperature Cycling

濕度測試 Humidity Test

冷熱沖擊 Thermal Shock

鍍銅通孔的耐熱沖擊性 Thermal Shock Resistance of Copper Plated -through Holes

遷移性 Migration

耐化學(xué)性 Chemical Resistance

清潔度 Cleanliness

阻燃性 Flame Resistance

推力測試 Shear Test

手機(jī)翻蓋測試 Handset Renovate Test

窗口彎折測試 Window Bend Test

手機(jī)滑蓋測試 Sliding Test

焊點拉伸強(qiáng)度測試 Solder Point Pull Strength Test

鹽霧測試 Salt Fog Test

蝕刻因子 Etching Factor

切片檢測 Cross Section

鍍層厚度 Plating Thickness

恒溫恒濕 Constant Temperature and Humidity

翻折疲勞測試 Fold Fatigue Test

安定性 Dimensional Stability

平展性 Ductility