工程類別

不良名稱中文

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導(dǎo)線

Visual Inspection of Conductors

導(dǎo)線

Conductors

開路

Open

短路

Short

缺口

Nicks

針孔

Pinholes

額外銅刺

Extraneous Copper Between Conductors

毛刺

Spurs

結(jié)瘤

Nodules

蝕刻凹痕

Etched Concave

導(dǎo)線分層

Conductor Delamination

裂紋

Cracks

導(dǎo)線劃痕

Scratches on Conductor

凹坑

Dents

變色

Discoloration

基底薄膜

Visual Inspection of Base Film

凹坑

Dents

劃痕

Scratches on Base Film

覆蓋層和覆蓋涂層

Visual Inspection of Coverlay and Covercoat

凹坑

Dents on Coverlay and Covercoat

劃痕

Scratches on Coverlay and Covercoat

空洞

Void

偏位

Coverlay Misalign

毛刺

Coverlay Burrs

外來物

Foreign Matters

導(dǎo)電性異物

Conductive Foreign Matters

非電性異物

Non-conductive Foreign Matters

起泡和分層

Blistering and Delamination

覆蓋層粘結(jié)劑擠出

Squeeze-out of Adhesive of Coverlay

覆蓋涂層滲出

Ooze-out of Covercoat

覆蓋涂層跳漏

Skipping of Convercoat

電鍍金屬或焊錫的表面條件

Surface Condition of Plated Mental and Solder

鍍金

Gold Plating

鍍金層缺陷

Gold Plating Defects

鍍錫

Tin Plating

電鍍金屬或焊料的滲透

Penetration of Plated Metal or Solder

變暗（變黑）

Darkened Appearance (Blackening Discoloration)

鍍銅孔內(nèi)鍍層空洞

Plating Voids in Plated-though Hole

鍍金粗糙

Rough Gold

鍍金白霧

Gold Discoloration

鍍金變色

Gold Discoloration

鍍金層龜裂

Gold Crack

鍍金針孔

Gold Pinhole

電鍍露銅

Plated Expose Wetting

剝離

Plated Peeled Off

電鍍滲入

Plated Wicking

漏鍍

No Plating

表面?zhèn)?/p>

Plating Scratch

電鍍粗糙

Rough Plated

藥水滲入

Wicking

外形和孔邊緣

Visual Inspection of Edges of Outline and Holes

撕裂和缺口

Tears and Nicks

毛刺

Burrs

絲狀毛刺

Thready Burrs

彎曲、變形

Warpage

微連筋不良

Poor Micro-joint

外形偏移

Outline Misalign

外形漏沖

No Outline

反折偏位

Bending Line Misalign

增強(qiáng)板

Visual Imperfections Related to Stiffener Bonding

FPC與增強(qiáng)板之間的外來物

Foreign Matter Between Flexible Printed Board and Stiffener

FPC與增強(qiáng)板之間的空洞

Voids Between Flexible Printed Board and Stiffener

裂紋

Cracks

缺角

Chip-off

劃痕

Scratches

變形

Deformation

表面附著物

Affixed Substances on the Surface

增強(qiáng)板貼偏移

Stiffener Misalign

熱固膠

Thermosetting Adhesive

焊劑殘?jiān)?/p>

Flux Residues

金屬粉末殘?jiān)?/p>

Residue of Metal Powders

粘結(jié)劑殘?jiān)?/p>

Residue of Adhesive

突起

Protrusions

凹坑

Dents

弓曲

Bow

扭曲

Twist

標(biāo)記Marking

尺寸檢驗(yàn)

Dimensional Inspections

尺寸測量

Measurement of Dimensions

外部尺寸

External Dimensions

厚度

Thickness

孔

Holes

元件孔

Component Holes

導(dǎo)通孔

Via Holes

導(dǎo)通孔偏移

Via Hole Misalign

安裝孔

Mounting Holes

導(dǎo)線寬度

Conductor Widths

導(dǎo)線之間的間距

Clearances Between Conductors

孔中心間距

Distance Between Hole Centers

板邊和導(dǎo)線之間的最小距離

Minimum Distance Between Board Edges and Conductors

標(biāo)記錯誤

Wrong Marking

字符不清晰

Unclear Letter

定位精度Positional Accuracy

孔的定位精度

Positional Accuracy of Holes

孔與焊盤的重合性

Registration of Hole to Land

覆蓋層與焊盤的重合性

Registration of Coverlay (or Covercoat) to Land

增強(qiáng)板與FPC的重合性

Registration of Stiffener to FPC

孔的重合性

Registration of Holes

外形的重合性

Registration of Outlines

沖外形與導(dǎo)線圖形的重合性

Registration of Punched Outline to Conductor Patterns

壓敏膠或熱固膠與FPC和增強(qiáng)板的重合性

Registration of Pressure Sensitive or Heat Activated Adhesives to FPC and Stiffener

鍍通孔的鍍銅層厚度

Plating Thickness of Copper Panted-through Holes

其它Other

短裝

Shortage

混裝

Mixed Stowage/Packing

離型紙脫落

Released Paper Peeled off

材料錯誤

Wrong Material