眾所周知。柔性電路板具有撓曲性和可靠性，在柔性電路板廠會(huì)對(duì)成品FPC進(jìn)行可靠性的測(cè)試，測(cè)試項(xiàng)目眾多，其項(xiàng)目名稱與英文對(duì)照如下:

  電氣性能 Testing of Electrical Performance
  導(dǎo)線電阻 Conductor Resistance
  表面層絕緣電阻 Surface Insulation Resistance (SIR)
  表面介質(zhì)層耐電壓強(qiáng)度 Dielectric Withstanding Voltage of Surface Layers
  機(jī)械性能測(cè)試 Testing of Mechanical Property
  剝離強(qiáng)度 Peel Strength
  孔和焊墊的拉脫強(qiáng)度 Pull-out Strength for Plain Holes and Footprints
  鍍層附著力 Plating Adhesion
  可焊性 Solderability
  耐撓曲性 Flexural Endurance
  耐彎折性 Bending Resistance
  環(huán)境性能 Environmental Performance
  溫度循環(huán) Temperature Cycling
  濕度測(cè)試 Humidity Test
  冷熱沖擊 Thermal Shock 
  鍍銅通孔的耐熱沖擊性 Thermal Shock Resistance of Copper Plated -through Holes
  遷移性 Migration
  耐化學(xué)性 Chemical Resistance
  清潔度 Cleanliness
  阻燃性 Flame Resistance
  推力測(cè)試 Shear Test 
  手機(jī)翻蓋測(cè)試 Handset Renovate Test
  窗口彎折測(cè)試 Window Bend Test
  手機(jī)滑蓋測(cè)試 Sliding Test 
  焊點(diǎn)拉伸強(qiáng)度測(cè)試 Solder Point Pull Strength Test
  鹽霧測(cè)試 Salt Fog Test
  蝕刻因子 Etching Factor 
  切片檢測(cè) Cross Section 
  鍍層厚度 Plating Thickness
  恒溫恒濕 Constant Temperature and Humidity 
  翻折疲勞測(cè)試 Fold Fatigue Test
  安定性 Dimensional Stability
  平展性 Ductility