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FPC柔性線路板不良項目名詞中英文對照

文章來源：作者：龔愛清查看手機(jī)網(wǎng)址

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人氣：12164發(fā)布日期：2017-05-06 11:32【大中小】

今天小編整理了FPC柔性線路板不良項目名詞中英文對照，和大家一起分享：

工程類別	不良名稱中文	英文
導(dǎo)線 Visual Inspection of Conductors	導(dǎo)線	Conductors
	開路	Open
	短路	Short
	缺口	Nicks
	針孔	Pinholes
	額外銅刺	Extraneous Copper Between Conductors
	毛刺	Spurs
	結(jié)瘤	Nodules
	蝕刻凹痕	Etched Concave
	導(dǎo)線分層	Conductor Delamination
	裂紋	Cracks
	導(dǎo)線劃痕	Scratches on Conductor
	凹坑	Dents
	變色	Discoloration
基底薄膜 Visual Inspection of Base Film	凹坑	Dents
基底薄膜 Visual Inspection of Base Film	劃痕	Scratches on Base Film
覆蓋層和覆蓋涂層 Visual Inspection of Coverlay and Covercoat	凹坑	Dents on Coverlay and Covercoat
	劃痕	Scratches on Coverlay and Covercoat
	空洞	Void
	偏位	Coverlay Misalign
	毛刺	Coverlay Burrs
外來物 Foreign Matters	導(dǎo)電性異物	Conductive Foreign Matters
	非電性異物	Non-conductive Foreign Matters
	起泡和分層	Blistering and Delamination
	覆蓋層粘結(jié)劑擠出	Squeeze-out of Adhesive of Coverlay
	覆蓋涂層滲出	Ooze-out of Covercoat
	覆蓋涂層跳漏	Skipping of Convercoat
電鍍金屬或焊錫的表面條件 Surface Condition of Plated Mental and Solder	鍍金	Gold Plating
	鍍金層缺陷	Gold Plating Defects
	鍍錫	Tin Plating
	電鍍金屬或焊料的滲透	Penetration of Plated Metal or Solder
	變暗（變黑）	Darkened Appearance (Blackening Discoloration)
	鍍銅孔內(nèi)鍍層空洞	Plating Voids in Plated-though Hole
	鍍金粗糙	Rough Gold
	鍍金白霧	Gold Discoloration
	鍍金變色	Gold Discoloration
	鍍金層龜裂	Gold Crack
	鍍金針孔	Gold Pinhole
	電鍍露銅	Plated Expose Wetting
	剝離	Plated Peeled Off
	電鍍滲入	Plated Wicking
	漏鍍	No Plating
	表面?zhèn)?/p>	Plating Scratch
	電鍍粗糙	Rough Plated
	藥水滲入	Wicking
外形和孔邊緣 Visual Inspection of Edges of Outline and Holes	撕裂和缺口	Tears and Nicks
	毛刺	Burrs
	絲狀毛刺	Thready Burrs
	彎曲、變形	Warpage
	微連筋不良	Poor Micro-joint
	外形偏移	Outline Misalign
	外形漏沖	No Outline
	反折偏位	Bending Line Misalign
增強(qiáng)板 Visual Imperfections Related to Stiffener Bonding	FPC與增強(qiáng)板之間的外來物	Foreign Matter Between Flexible Printed Board and Stiffener
	FPC與增強(qiáng)板之間的空洞	Voids Between Flexible Printed Board and Stiffener
	裂紋	Cracks
	缺角	Chip-off
	劃痕	Scratches
	變形	Deformation
表面附著物 Affixed Substances on the Surface	增強(qiáng)板貼偏移	Stiffener Misalign
	熱固膠	Thermosetting Adhesive
	焊劑殘渣	Flux Residues
	金屬粉末殘渣	Residue of Metal Powders
	粘結(jié)劑殘渣	Residue of Adhesive
	突起	Protrusions
	凹坑	Dents
	弓曲	Bow
	扭曲	Twist
標(biāo)記Marking	尺寸檢驗	Dimensional Inspections
	尺寸測量	Measurement of Dimensions
	外部尺寸	External Dimensions
	厚度	Thickness
	孔	Holes
	元件孔	Component Holes
	導(dǎo)通孔	Via Holes
	導(dǎo)通孔偏移	Via Hole Misalign
	安裝孔	Mounting Holes
	導(dǎo)線寬度	Conductor Widths
	導(dǎo)線之間的間距	Clearances Between Conductors
	孔中心間距	Distance Between Hole Centers
	板邊和導(dǎo)線之間的最小距離	Minimum Distance Between Board Edges and Conductors
	標(biāo)記錯誤	Wrong Marking
	字符不清晰	Unclear Letter
定位精度Positional Accuracy	孔的定位精度	Positional Accuracy of Holes
	孔與焊盤的重合性	Registration of Hole to Land
	覆蓋層與焊盤的重合性	Registration of Coverlay (or Covercoat) to Land
增強(qiáng)板與FPC的重合性 Registration of Stiffener to FPC	孔的重合性	Registration of Holes
	外形的重合性	Registration of Outlines
	沖外形與導(dǎo)線圖形的重合性	Registration of Punched Outline to Conductor Patterns
	壓敏膠或熱固膠與FPC和增強(qiáng)板的重合性	Registration of Pressure Sensitive or Heat Activated Adhesives to FPC and Stiffener
	鍍通孔的鍍銅層厚度	Plating Thickness of Copper Panted-through Holes
其它Other	短裝	Shortage
	混裝	Mixed Stowage/Packing
	離型紙脫落	Released Paper Peeled off
	材料錯誤	Wrong Material